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Materials- and Geosciences

Competence Centre for Materials Characterisation

Picture: Katrin Binner

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Wire Bonder

HB 10, tpt

Wire bonder (HB 10, tpt) for making contact to electronic devices. The bond wire is thinner than the human hair. Flip-chip-Bonding is possible.

Wire Bonder
Picture: Gabi Haindl

Topics

Advanced Thin Film Technology (DS)

Related articles

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  • MBE
  • Sputter System
  • SQUID
  • Magnet Cryostat
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Contact

Dr. Philipp Komissinskiy

Picture: Philipp Schreyer

philipp.komissinskiy@tu-...

work +49 6151 16-20698

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