The sputter coater is used to deposit metallic thin films by Ar-sputtering of metallic targets. Sequential deposition of two different materials is possible by using two sputter heads.
|targets||Au, Cr (standard); noble or oxidizing metals (Pt, Al, Cu, Ag etc.)|
|target dimensions||54-57 mm ø|
|vacuum||10-4 hPa (turbo pumping)|
|sample size||up to 10 cm ø|
|film thickness monitor|
|touch screen control|